Micro Materials Inc. (MMI) is a technology company dedicating to develop innovative thin wafer handling solution for 3D vertcal integration of MEMS, IC, memory and CMOS image sensor. Currently, Micro Materials Inc. is the only company in the world using AIR JETTING to debond device wafer after thinning. To best serve customer's demand, Micro Materials Inc. has established full set of development capability in house. Customer can evaluate equipment, material, and all aspects of the technology ONE STOP in Micro Materials Inc..
Services/Products
6 inch and 8 inch silicon/CuW/glass/ceramics wafers Temporary/Permanent bonding and de-bonding services.
Location
900 Calle Plano, Unit M&N Camarillo, CA 93012, United States