Founded in 1971, International Micro Industries Inc. is a provider of wafer bumping and wafer level processing (WLP) contract services to EMS customers and end-users in the advanced packaging, MEMS and advanced sensor markets. It has expertise in delivering semiconductor-packaging solutions to the defense and commercial industry. The company is engaged in contract production, research, manufacturing, advanced machine design and packaging for the semiconductor and electronics industry. International Micro Industries Inc. serves its customers in the medical implantable, medical disposable, automotive, DOD, aerospace, advanced sensor, communication and radio frequency identification businesses.
Fax: (856) 616-0226
Electroplated Metals, Bump Geometries, Cu Pillar Bump, Redistribution