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Semiconductor Equipment manufactures and distributes standard and customized die handling equipment and semiconductor dicing tape. The company strives to be one of the leading designers and manufacturers of a wide range of manual and semiautomatic assembly, rework, handling and test equipment that is used in the development and production of microelectronic devices for the photonics, semiconductor, hybrid and printed circuit industries. Since 1975, Semiconductor Equipment has developed custom prototype equipment and applications to meet the ever-changing demands of the photonics and semiconductor industries. The company s standard equipment includes die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape and mounting equipment. Semiconductor Equipment is based in Moorpark, Calif.
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Fax: (805) 529-2193

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Semiconductor Equipment Corporation

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Phone: (805) 529-2293

Address: 5154 Goldman Ave, Moorpark, CA 93021

Website: http://www.semicorp.com

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